With thousands of dies being produced in each run, and with every project being unique, how can we make sure that you get the best results and yield?
With thousands of dies being produced in each run, and with every project being unique, how can we make sure that you get the best results and yield?
Run 1 bare dies have shipped. Now we are working through chip-on-board packaging for customers who ordered that add-on.
The wafer.space community is developing a flexible chip-on-board packaging strategy, so you won't need specialised equipment or expensive packaging services to use your chips.