Wafers Delayed for Run #2

Hi everybody, we have got some important news to share with you regarding the timeline for Run #2.

We are expecting an initial set of wafers from Global Foundries very soon! These wafers will be diced, with bare die shipping and packaging happening soon after. We’ve made many improvements to our chip-on-board service too, which we will share in an upcoming update soon!

Unfortunately, there are only enough wafers for everyone to get roughly 100-200 dies. The remaining wafers for Run #2 have been delayed until sometime in 2027. We don’t have an exact date yet, but we will update you as soon as we know. We recommend that you join the wafer.space Discord to stay in the loop.

Additionally, we do not expect this delay to affect any deadlines or the timeline for Run #3.